Summit Systems Debuts at Packaging Innovations Exhibition in Birmingham
29 January 2024
Summit Systems will be exhibiting at the Packaging Innovations exhibition at NEC Birmingham on February 21-22, to showcase its diverse range of recycling products and total waste management services tailored to revolutionise the packaging industry.
A key influence in Summit Systems' participation is the opportunity to spotlight their Total Waste Management services—a rapidly expanding division within the company. This underscores their unwavering commitment to delivering efficient and cost-effective total waste management solutions for clients. Backed by a team of seasoned experts, Summit Systems is well-equipped to handle various recyclable materials, diverting waste from landfills and contributing to a sustainable and eco-friendly planet.
Recognising the current emphasis on recycling and reusing waste materials within the packaging industry, Summit Systems range of products and services supports the Plastic Packaging Tax, which was introduced in 2022. The range of cutting-edge granulators and shredders enables manufacturers to recycle and repurpose waste materials generated during the manufacturing process.
Summit Systems extends its support further by sourcing polymer compounds from reputable suppliers across the UK. This move not only champions the reduction of environmental impact but also promotes the responsible use of plastics. With a diverse array of polymer offerings, businesses can choose from a wide range of materials to meet their specific manufacturing needs, all while benefiting from full traceability on the entire journey of the recycled materials.
Visitors to the Summit Systems stand at Packaging Innovations can expect insightful discussions with the company's representatives. They are eager to engage with packaging manufacturers, exploring ways to enrich and support manufacturing and waste processes. By participating in this influential exhibition, Summit Systems aims to establish strong partnerships and contribute to the industry's collective efforts toward a greener and cleaner future.
Summit Systems invites all attendees to join them on Stand U50 at the NEC for Packaging Innovations, on February 21-22, to discover firsthand the innovative solutions that will shape the future of waste management within the packaging industry.